i find desolder the 2nd processore more easy than the first
may be the 3rd one will be d?solder and resoldere with succes
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i find desolder the 2nd processore more easy than the first
may be the 3rd one will be d?solder and resoldere with succes
![]()
Last edited by grinovsky; 15th July, 2011 at 11:47 AM.
there are bga kits for this kind of processor, and they are not so expensive...so the job can be done quite easily if you have the propre tools..
anyway, does anybody try to read this proc of the boardthis should interesting
I can give you some tips...
1st - Get a good IR (ceramic, dark IR) soldering Machine
2nd - Pre Heat and Bottom Heat are the most important.
3rd - Upper heat cannot be too much temperature. It's easier to damage the chip than the MB.
Some people prefer hot air for BGA, i prefer IR... Cleaner and easier.
Regards,
MCDC
WELCOME TO mcdc TO DK FORUM![]()
I do loads of BGA reballing for laptops. Good BGA jig and decent tacky flux is the key. I use hot air because I'm poor so can't afford IRDA. It just take practice, and 300 degrees C![]()
As na IPC certified BGA technician (i know it really doesn't mean much to some) I can tell you from my practise that decent hot air station is better than IR. Of course hot air got it's limits like it can't be used with plastic connectors and so on but still for clear BGA i prefer hot air. The key is decent station with decent pre-heater and a good control of whole process in meaning of three stages. You also mention about flux - and you right what's also important in this case is to know properties of the one you using (activation and deactivation temp.). Following few "iron" rules will lead you to 95% of success. BTW if some one needs a hand or tips in subject of soldering BGA feel free to ask me - I can share some IPC materials and some experience.
use irda staion for big proccesor with bga....
work like a charm....
i have distroyed some pcb with hot air....
i speak from my experience
I have this one,but dont know how to use it,no instructions,used it once,then the components fell of from the bottom of the pcb,but it removes plastic without melting,here is the link, up for sale,if anyone is interested.
BGA Rework
watch the tutorial in youtube.... and experiment`s in some pcb broken...
Yes but this one its a bit complicated for me, i prefare hot air! and the tools support,i was told its not bad,basically you can give it profile,and you have to reshape the heat sensor slightly,but will you tube it, i have used it only few times,and it was quite good removing plastic connectors,without melting them!
You see the problem with bga work is for example you have to buy solder past or solder balls!, but the paste will go off within 6 months,and also you have to obtain different stencil for different chips, unless you do a lot of these then its worth doing the bga work! thnx for the you tube link,never thought to look in there!
Last edited by nazz2; 18th July, 2011 at 12:53 PM.
I often do laptops and for example I've had few Toshibas where IRDA station was bending the PCB even if process was controlled with 100% attendance (normally for most things I'm using my custom profiles and don't care too much). Why I could not do those Tosh's with IRDA stays unexplained to me but i guess some ingredient of laminate was reacting badly to IR. That's why I rather stay with hot air if its about BGA, but as I said before - reworking plastic component's like RAM slots etc. infra-red is unbeaten.
I?ve done a lot of BGA-repairs in my previous job with Weller WQB 3000 BGA soldering station. Worked really well and with good results.
The company got bankrupt and we bought the station recently for my own company. Finally we get to do some serious bga-repairs. =)
The original author of Siemens Simtec 70/71, Delco HSFI-2.X and Audi Multitronic repair instructions.
The American company IBM has announced that it has developed a computer chip that can mimic human brain function
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jep darl ir rules , i ove my re8500 , hot air can damage some parts ,dark ir its clean etc..
to all the people saying hot air can do damage you are obviously doing something wrong (or have bad equipment)
I've got a sp-360c far better than re8500 as you've got a general area heater then top and bottom heater, you can apply most heat from the bottom heater and also supports the motherboard.
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