zyldelfer (5th June, 2020)
Put a little flux on the surface of pads of eeprom.Then use the hotairgun 5-6 cm of the eeprom (temp 300-350 degrees) and then with a tweezer grab the eprom gently ,not to hard because you can easily rip the pcb traces.Afterwards with some solderwek remove the old solder of the pcb,put some flux and solder back your eeprom .It comes very handy and easy after a few tries.Good luck
280 deg is hot enough to remove the chip with a hot air gun, 350 deg will fry the chip, happened to me only once because I failed to look up the temperature that the chip can with stand
i work everyday with eeproms and mcus ,my soldering station is set to 350 degrees.Depends on my hand skills i guess
wet the feet with iron solder using low melting tin (e.g. quick alloy) and then you can remove the component even at 250 degrees with your hot air station .
fuzz1 (9th April, 2020)
SOrry for late answer ... anyway the type of welding technique varies from the type of component, DIP (common eeprom) QFP and BGA. For the eeprom i use wet the prints with a bit of common tin paste or wire 60/40, no low fusion tin because it tends to crystallize and to crack on solder joint. Then with the soldering iron with a 0.2 mm tip (I recommend the copper tips) I help myself with the tweezers and I begin to go over the feet again. You can also use the hot air by shielding the nearby components with Kapton tape, air speed. medium and rotation of the handpiece so as not to concentrate the air on a single point. For QFP components the same story applies while for BGA it requires experience and a lot of pages...
dip.PNGqfp.jpgbga.jpg
Last edited by orx; 28th May, 2020 at 10:01 PM.
fuzz1 (5th November, 2021)
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