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No a hair dryer wont get nearly hot enough, you would really need a infrared thermometer if you are going to try to fix it via a heatgun.
Without the IR you risk completly breaking it by getting it to hot or not getting it hot enough and having it break again in a few weeks.
Probably best bet would be to get a new xbox and sell the faulty one.
You could try and find somewhere with better equipment that can remove the chips and reball them with leaded solder balls, but I doubt most places would reball rather than reflow them.
if you do try the heat gun you ideally need to heat the board to around 180-200 degrees then heat the gpu or/and cpu to just over 230 degrees then hold the temp for a few seconds at least. (at high temperature it's more important to keep the heatgun moving else you'll blister the chips/board)
Then you've got 2 option let it cool down quickly pro's are the solder will be stronger and less likely to crack whilst cooling. Cons the board is more likely to warp cracking the balls anyway.
or slowly and evenly bring the temp down of the board/cpu/gpu. Pros the board will not warp. Cons slowly cooling the solder will lead to slightly weaker balls than quickly cooling them. Also this allows the board to 'dry', as heating it up will cause condensation.
I'd apply a bit of heat mainly on the board only as the board will cool quicker than the cpu/gpu, this will keep the temp even but allow it to cool fairly fast.
Slowly bring the temp of the cpu/gpu and board to around 170. Then you can let it cool down a little quicker.
Once the board is around 60 degrees you can just let it cool down.
if you do try the heat gun you ideally need to heat the board to around 180-200 degrees then heat the gpu or/and cpu to just over 230 degrees then hold the temp for a few seconds at least. (at high temperature it's more important to keep the heatgun moving else you'll blister the chips/board)
Then you've got 2 option let it cool down quickly pro's are the solder will be stronger and less likely to crack whilst cooling. Cons the board is more likely to warp cracking the balls anyway.
or slowly and evenly bring the temp down of the board/cpu/gpu. Pros the board will not warp. Cons slowly cooling the solder will lead to slightly weaker balls than quickly cooling them. Also this allows the board to 'dry', as heating it up will cause condensation.
I'd apply a bit of heat mainly on the board only as the board will cool quicker than the cpu/gpu, this will keep the temp even but allow it to cool fairly fast.
Slowly bring the temp of the cpu/gpu and board to around 170. Then you can let it cool down a little quicker.
Once the board is around 60 degrees you can just let it cool down.
thanks for your help i will come back when i get the gun.
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